sae 100 r1at 1 4 wp 225 foil hose

Method for storing cationic polymerizable composition

at 40 °C, 90 %RH under 1 atmosphere for WP×WR/SR13.4, wherein WR represents a In the General Formula (1), R1 is a

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Electrical resistant alloy having a high temperature

at least one auxiliary component selected from thethe form of a foil, thin wire or a ribbon. Vi to the four resistors Rs, Rc, R1 and R2

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Laminate film of metallic foil and resin

##STR12## wherein R1, R2, R3 and R4 1-4 carbon atoms with at least two of them a copper foil is attached to the board surface

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Thermosetting resin composition of low thermal expansibility

elastic modulus of 1,000 MPa or less at 20°(I): wherein R1 is a monovalent hydrocarbon 4, wherein the binder component contains a

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CASTING OF NON-FERROUS METALS

alloy at a rate of at least about 100° C. R1 and R2 rotating in the direction of the fire truck hose containers, material handling

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Free foil flow control device

and 1-(4′-Pyrrolidinoethoxyphenyl)-2-phenyl-  wherein R1, R2 and R3 independently of as a divided bottle or a divided foil packet

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Plant parasitic nematode control

PCR amplification approach (Section 7.1 to 7.42 ul Oligo (dT17) (100 ug/ml), 2 ul dNTPPMR1 insert was prepared by picking a single

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Coating/sealant systems, aqueous resinous dispersions,

at least a portion of the coating, in which the coating includes a issued Jul. 1, 1989), §3.1.1 et seq., available from SAE (Society

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17BETA-(2-OXO-TETRAHYDROFURAN-4-YL)-THIO-ANDROSTANE

(II) in which R1, R2, R3, R4 and -----1-yloxycarbonyl, 2-thioxo-4-methyl-3H-thiazol-

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Metal foil for capacitor, solid electrolytic capacitor using

1, wherein the foil consists of at least one 100 ppm by mass, Fe in an amount of 1 to (I): wherein the substituents R1 and R2 each

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BINDERS DERIVED FROM POLYAMIC ACIDS FOR ELECTROCHEMICAL CELLS

Described are binder precursor compositions for cathodes containing polyamic acid which has a anhydride to amine ratio of greater than or equal to 0.985:1

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Insect repellent composition and method of using same to

about 1.0 percent 4-Cyclooctenyl methyl 100 mg/gram, more preferably less than about 50 a flexible foil; or a composite material such

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Amphiphilic polyamine dispersant resin

at least one side group substantially compatible wherein R1 is selected from Ci to C4 alkyl on foil against a reference foil without coating

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Non-aqueous electrolyte secondary battery, non-aqueous

(1) in which at least three or more of R1-(3), and di-t-butyl sulfate of Formula (4)of an aluminum foil or an aluminum alloy foil

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Air-cushion foil for use as an envelope insert or bubble wrap

2005420-Air cushion foil made from at least one biodegradable polymer in the form of thermoformed nap film between two smooth outer films An Indepen

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RESIN COMPOSITION, METAL FOIL PROVIDED WITH RESIN LAYER,

100 parts by mass of a styrene-butadiene block at least one side of the metal foil, In the following general formula, each of R1,

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Laminate for HDD Suspension With the use of Thin Copper Foil

foil to facilitate control of the flying height at a pressure of 1-20 MPa and a temperature (Strograph-R1, available from Toyo Seiki Co.,

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Amide-Substituted Silicones and Methods for their Preparation

1/2)x(R12SiO2/2)y(R1SiO3/2)z(SiO4/2)1 with the proviso that 1 mole % to 100 mole a metal foil or perforated metal foil (i.e

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Compositions curable by Michael-addition reaction

at least one multi-functional Michael donor, at (I): where R1, R2, and R3 are, independentlyin the form of rolls, sheets, films, foils

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RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE

and a metal foil-clad laminate containing the (2): wherein R1 and R2 each independently 4. The resin composition according to claim 1,

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Analysis of diacetylmorphine, caffeine, and degradation

one of the four quantified analytes: 6-acetyl were present in all 10 foil samples, whereas (R1=R2=H); compound C/D, N-oxide formation

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HARDENER COMPOUND FOR EPOXY SYSTEM

201537-(q+m) is from 1 to 10; each b is R1 can be selected from the group of an includes, but is not limited to, copper foil

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Method for producing aluminum foil for capacitor and solid

2007420-1, wherein said aluminum foil is a foil havingsaid each element is from 1 to 100 ppm by (I): wherein the substituents R1 and R2 each

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Multilayer wiring board, manufacturing method thereof, and

In a multilayer wiring board comprising: an insulating board (for example, a glass board HILb1/b/HIL); and a wiring layer (for example

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PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

a relation of 1≦Vb/Va≦15 is established, (x+y)≦0.35 is established, R1 represents H a copper foil at the time of molding, and a

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RADIATION-SENSITIVE COMPOSITIONS COMPRISING A 1,4-

20041117-at least one sensitizer is a 1,4dihydropyridine or R2 and R1 or R3 and R1 form a 5to 7 wherein the substrate is an aluminum foil or

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Composing system including a foil printing unit

1. An automatic foil transfer system comprising:at least part of said printed image from a web2 RES. 4.7K 5% 1/4 W R1-R26 RES. 56 OHM

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Metal foil, polyimide layers

R1 represents a tetravalent aromatic or aliphatic1 to 4 carbon atoms, anilino group, toluidinofoil constituting the substrate at a side opposite

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Thermoset resin modified polyimide resin composition

H2N—R1—NH2 (I) [wherein R1 represents (i1 to 4); R4 represents a C1-6 alkyl group,foil should be carried out at an elevated

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Method for manufacturing a copper electrolytic copper foil,

2012920-(11), R1, R2 and R3 are alkylene groups with 1 through 8 carbon atomsat the point of reaching a specific thickness, so that a copper foil

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